Local synthesis of carbon nanotubes for direct integration in Si microsystems - design considerations     

Knut  E.  Aasmundtveit Bao  Quoc Ta  Quoc-Huy Nguyen  Tormod  B.  Haugen Nils  Hoivik Einar  Halvorsen 《上海大学学报(英文版)》2013,(3):218-225

The integration of nanomaterials such as carbon nanotubes （CNTs） into microsystems is highly desirable, in order to make use of the unique nanomaterial properties in real devices. However, the CNTtomicrosystem integration is challenging to implement in a manufacturable, cost effective industrial process. This paper presents our work towards a process for making complete, integrated CMOS / MEMS systems with integrated CNT. We demonstrate the feasibility of the process, using roomtemperature process ing, lowcost equipment and consumables, and electrical control with automation possibilities. CNTs are directly integrated at the desired positions in the Si microsystem, forming closed Si / CNT / Si circuits. We explore different designs with the aim to obtain uniform and welldefined CNT synthesis conditions, and show that simplified designs can perform comparably to more complex ones. The Si / CNT / Si circuits obtained can show rectifying （Schottky like） or nearohmic behavior. Gas sensing possibilities are demonstrated, indicating the possibility of monitoring aging/ fermenting of food. Functionalization of CNTs is demon strated, using thermal evaporation of Sn and Pd, opening for selective and sensitive sensors for various gases and ana lytes. Detailed microscopic characterization of the obtained CNTs are presented.  相似文献   

Wafer-level SLID bonding for MEMS encapsulation     

H.  Xu T. Suni  V.  Vuorinen J. Li  H.  Heikkinen P. Monnoyer  M.  Paulasto-Krockel 《上海大学学报(英文版)》2013,(3):226-235

Hermetic packaging is often an essential requirement to enable proper functionality throughout the device＇s lifetime and ensure the optimal performance of a micro electronic mechanical system （MEMS） device. Solid-liquid interdiffusion （SLID） bonding is a novel and attractive way to encapsulate MEMS devices at a wafer level. SLID bonding utilizes a low-melting-point metal to reduce the bonding process temperature; and metallic seal rings take out less of the valuable surface area and have a lower gas permeability compared to polymer or glass- based sealing materials. In addition, ductile metals can adopt mechanical and thermo-mechanical stresses during their service lifetime, which improves their reliability. In this study, the principles of Au-Sn and Cu-Sn SLID bonding are presented, which are meant to be used for wafer-level hermetic sealing of MEMS resonators. Seal rings in 15.24 cm silicon wafers were bonded at a width of 60 gin, electroplated, and used with Au-Sn and Cu-Sn layer structures. The wafer bonding temperature varied between 300 ℃ and 350 ℃, and the bonding force was 3.5 kN under the ambient pressure, that is, it was less than 0.1 Pa. A shear test was used to compare the mechanical properties of the interconnections between both material systems, in addition, important factors pertaining to bond ring design are discussed according to their effects on the failure mechanisms. The results show that the design ofmetal structures can significantly affect the reliability of bond rings.  相似文献   

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD     

Liang Xu  Di Jiang  Yi-Feng Fu  Stephane Xavieras  Shailendra Bansropun  Afshin Ziaei  Shan-Tung Tu  Johan Liu 《上海大学学报(英文版)》2013,(3):236-240

Due to their unique thermal, electronic and mechanical properties, carbon nanotubes （CNTs） have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical vapor deposition （PECVD） has been extensively developed as one growth technique to produce verticallyaligned car bon nanotubes （VACNTs）. Though CNTs show a trend to be integrated into nanoelectromechanical system （NEMS）, CNT growth still remains a mysterious technology. This paper attempts to reveal the effects of substrates and un derlayers to CNT synthesis. We tried five different substrates by substituting intrinsic Si with high resistivity ones and byincreasing the thickness of SiO2 insulativity layer. And also, we demonstrated an innovative way of adjusting CNT den sity by changing the thickness of Cu underlayer.  相似文献   

Simultaneous optimization of multiple performance characteristics in WEDM for machining ZC63/SiCp MMC     

Thella Babu  Rao  A.  Gopala Krishna 《上海大学学报(英文版)》2013,(3):265-275

Abstract The compliance of an integrated approach, principal component analysis （PCA）, coupled with Tagu chi＇s robust theory for simultaneous optimization of cor related multiple responses of wire electrical discharge machining （WEDM） process for machining SiCp rein forced ZC63 metal matrix composites （MMCs） is investi gated in this work. The WEDM is proven better for its efficiency to machine MMCs among others, while the particulate size and volume percentage of SiCp with the composite are the utmost important factors. These improve the mechanical properties enormously, however reduce the machining performance. Hence the WEDM experiments are conducted by varying the particulate size, volume fraction, pulseon time, pulseoff time and wire tension. In the view of quality cut, the most important performance indicators of WEDM as surface roughness （Ra）, metal removal rate （MRR）, wire wear ratio （WWR）, kerf （Kw） and white layer thickness （WLT） are measured as respon ses. PCA is used as multiresponse optimization technique to derive the composite principal component （CPC） which acts as the overall quality index in the process. Consequently, Taguchi＇s S/N ratio analysis is applied to optimize the CPC. The derived optimal process responses are confirmed by the experimental validation tests results. The analysis of vari ance is conducted to find the effects of choosing process variables on the overall quality of the machined component.The practical possibility of the derived optimal process conditions is also presented using SEM.  相似文献   

Clothing skirt designed on conical truss model     

Eri Nakayama  Sachiko Ishida  Yu-Jing Liao  Ichiro Hagiwara 《上海大学学报(英文版)》2013,(2):130-135

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（5＋1）S管理在研究生素质教育中的应用探索     

严增民  刘珩 《中国地质教育》2013,(4):35-38

5S管理起源于日本,后广泛应用于企业管理中.在我国,5S管理较为广泛地应用于企业、现场管理以及需要整理和卫生要求高的机构中,其他领域尚未引起足够的重视.中国石油勘探开发研究院研究生部将企业管理引用到研究生素质教育中,并增加1S,形成（5＋1）S管理,通过宣传、教育、引导、监督、激励等措施,加强管理,不断渗透,促使研究生养成良好的习惯,提升个人素质.  相似文献   

火焰原子吸收法测量莎草科两种药用植物微量元素的含量     

侯洪波  何茂江徐　娟 《德州学院学报》2013,(6):60-62

采用干法灰化处理植物体样品,湿法处理土壤样品.用火焰原子吸收法测定香附子与大香附中Mg、Cr、Mn、Fe、Ni、Cu、Pb等7种微量元素的含量.结果显示：香附中各元素的总体含Mg＞ Fe＞ Ni＞ Mn＞Cu＞ Pb＞Cr,大香附Mg＞Fe＞ Mn＞ Ni＞Cu＞ Pb＞Cr.两种植物对Mg外的6种元素的富集系数都小于1.同种元素在同一植株中不同部位的含量不同.香附中：Mg元素叶＞根＞茎;Fe、Cr、Ni、Pb四种元素含量根＞叶＞茎;Cu、Mn是叶＞茎＞根.大香附中：Mg元素叶＞根＞茎;Cr、Mn、Ni三元素含量根＞茎＞叶;Fe根＞叶＞茎;Cu、Pb的含量茎＞根＞叶.两种草药的Cr、Pb含量均超过2000年的《中国药典（一部）》标准.  相似文献   

农业推广硕士专业学位研究生教育综合改革的实践与思考——以石河子大学农村与区域发展领域为例     

程广斌  王永静 《研究生教育研究》2013,(6):82-85

探索适合专业学位研究生的培养模式是新时期我国研究生教育改革的重要内容。在分析石河子大学农业推广硕士（农村与区域发展领域）的综合改革及其成效的基础上,从转变观念、创新课程体系、优化导师队伍、加强实践基地建设、改善培养条件等方面,就如何进一步创新农业推广硕士培养模式进行了思考和总结,为今后做好专业学位研究生教育工作理清了思路。  相似文献   

《何典》“易”的本字及考本字的原则与方法     

龙向平 《凯里学院学报》2013,(5):85-90

对《何典》“烊易”一词中的“易”字,通过系联同源词、清理引申义列以及分析语义特征,对其本字为何再加以考辨,说明考订方言词本字应注意的一些问题与应遵循的一些基本原则,如：注重对引申义列与语义特征的清理;遵循语音、语义、文字相结合的原则,结合文献用例进行分析的原则,以及历时与共时的分析相结合的原则等。  相似文献   

论神州国光社的政治意图与文化策略(1930—1933)     

鞠新泉 《历史教学(高校版)》2009,(2)

1930年,国民党十九路军领袖陈铭枢接办当时趋于没落的神州国光社,并网罗了王礼锡、胡秋原等知识分子主持社务,意欲为自己的反蒋事业提供舆论和理论上的支持。在王礼锡等人的努力下,神州国光社通过一系列的文化策略,包括审时度势地为知识分子提供学术探讨的空间、对思想论辩进行"因势利导"等等,为陈铭枢政治活动提供了文化人才,而且对中国社会与蒋介石政权的性质进行了反思,从而起到鼓动革命的效果并最终形成反蒋的纲领。  相似文献